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- Article name
- THERMAL ANALYSIS OF ELECTRONIC EQUIPMENT USING CFD-ANALYSIS MODULES
- Authors
- Kurnosenko A. E., , info@iu4.bmstu.ru, Bauman Moscow State Technical University, Moscow, Russia
Loshak D. I., , info@iu4.bmstu.ru, Bauman Moscow State Technical University, Moscow, Russia
- Keywords
- computational fluid dynamics / thermal analysis / cooling systems / electronic equipment
- Year
- 2019 Issue 3 Pages 44 - 50
- Code EDN
- Code DOI
- Abstract
- The article deals with modern approaches to the analysis of thermal conditions inside the electronic equipment. The modern requirements of the industry, imposing restrictions on the time of development of the final product, as well as on the size of the devices are considered. The basic functionality of modern systems for thermal analysis using computational fluid dynamics methods, as well as the possibility of modeling complex heat exchange devices is shown.
- Text
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