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- Article name
- Optimization of indium bumps welding temperature for assembly of FPA photodetectors
- Authors
- Predein A. V., , alpred@thermo.isp.nsc.ru, Institute of Semiconductor Physics, Siberian Branch of Russian Academy of Science, 13 Lavrentyev av., Novosibirsk, 630090, Russia
Vasilyev V. V., , alpred@thermo.isp.nsc.ru, Institute of Semiconductor Physics, Siberian Branch of Russian Academy of Science, 13 Lavrentyev av., Novosibirsk, 630090, Russia
Novoselov A. R., , novoselov@thermo.isp.nsc.ru, Institute of Semicondactor Physics, 13 Lavrent'ev av., Novosibirsk, 630090, Russia
Kosulina I. G., , , Institute of Semicondactor Physics, 13 Lavrent'ev av., Novosibirsk, 630090, Russia
- Keywords
- photodetector / photoreception module / columm / indium / temperature
- Year
- 2010 Issue 1 Pages 73 - 77
- Code EDN
- Code DOI
- Abstract
- During assembly of photodetector module by flip-chip method a silicon multiplexer and a photodetector circuit (photodiodes array manufactured on heteroepitaxial p-type HgCdTe) are subjected to high thermal and deformation strain. In this paper experimental data are presented showing a method of photodetector array and silicon multiplexer assembly at temperature of 120 ˚C and pressure less than 1,56⋅107 N/m2 without deterioration of n-p junction parameters.
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