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- Article name
- INFORMATION TECHNOLOGY FOR MANUFACTURING DEFECTS DIAGNOSING IN PRINTED CIRCUIT ASSEMBLIES USING TEMPERATURE FIELDS
- Authors
- Sotnikova S. Yu., , sveta1708@mail.ru, ANO "Reliability Academy", Moscow, Russia
Tikhonov A. N., , Atikhonov@hse.ru, Moscow Institute of Electronics and Mathematics of National Research University "Higher School of Economics", Moscow, Russia
Uvaysov S. U., , s.uvaysov@hse.ru, Moscow Institute of Electronics and Mathematics of National Research University "Higher School of Economics", Moscow, Russia
Suleymanov S. P., , sergprof@ya.ru, National Research University "Higher School of Economics", Moscow, Russia
- Keywords
- manufacturing defect / the base of the fault / thermogram / thermal field / thermal modeling
- Year
- 2015 Issue 1 Pages 40 - 46
- Code EDN
- Code DOI
- Abstract
- The paper describes the approach to the diagnosis of printed circuit assemblies, based on preliminary modeling of thermal processes. Given the condition of uniqueness of defects in the diagnostic process. Shows the effect of manufacturing defects on the change of the printed circuit assemblies thermal field and how using the simulation resulting thermogram, to form the base of the fault.
- Text
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