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- Article name
- REENGINEERING STUDY OF PCB WITH MULTI-LAYER TOPOLOGY IN ASPECTS ENSURING TECHNICAL COUNTERACTION
- Authors
- Markov D. V., , 3301100@gmail.com, Military unit № 11928, Moscow, Russia
Kostin M. S., , mihailkos@mail.ru, Moscow Technological University, Moscow, Russia
Vorunichev D. S., , vorunichev@mirea.ru, Moscow Technological University, Moscow, Russia
- Keywords
- special project reengineering / multi-layer PCB / PCB topology / technical counteraction to prototyping / radioelectronic device
- Year
- 2018 Issue 1 Pages 47 - 56
- Code EDN
- Code DOI
- Abstract
- The methods and means of special project reengineering of modules of multi-layer PCB. The given basic design and technological solutions for reengineering of multi-layer PCB modules of radioelectronic facilities based on the physical principles of destructive and non-destructive research: mechanical processing and chemical etching, stereolaser scanning, termovision electrothermy, X-ray analysis. The conceptual approach of technical counteraction to special design researches of products of radioelectronic means is formulated. It is shown that methods of nondestructive action provide a high-precision reproducibility without disrupting structural and radiophysical connections in the topology and physicochemical structure of the test sample of PCB radioelectronic device.
- Text
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