To obtain access to full text of journal and articles you must register!
- Article name
- DESIGN UNCASED MULTICONNECTION INTEGRATED CIRCUITS WITH BALL CONCLUSIONS WITH USE FINITE-ELEMENT MODELS
- Authors
- Pogalov A. I., , dtm@miee.ru, Moscow Institute of Electronic Technology (Technical University), Moscow, Russia
Blinov G. A., , mg@miee.ru, Moscow Institute of Electronic Technology (Technical University), Moscow, Russia
Dolgovykh Yu. G., , wise85@bk.ru, Moscow Institute of Electronic Technology (Technical University), Moscow, Russia
- Keywords
- design / technology / uncased integrated circuits / ball conclusions / flexible board / modeling
- Year
- 2012 Issue 4 Pages 77 - 80
- Code EDN
- Code DOI
- Abstract
- Developed computer finite-element models for researches on mode of stressed-deformation materials uncased multiconnection integrated circuits (IC) with ball conclusions. A method of manufacturing uncased integrated circuits with ball conclusions on a flexible board.
- Text
- To obtain access to full text of journal and articles you must register!
- Buy
