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- Article name
- THERMAL BURDENING OF FUNCTIONAL THREE-DIMENSIONAL MULTICHIP MICROMODULES
- Authors
- Pogalov A. I., , dtm@miee.ru, Moscow Institute of Electronic Technology (Technical University), Moscow, Russia
Blinov G. A., , mg@miee.ru, Moscow Institute of Electronic Technology (Technical University), Moscow, Russia
CHUGUNOV E. Yu., , , National Research University of Electronic Technology, Moscow, Russia
- Keywords
- three-dimensional multichip module / thermal burdening of the micromodules / strength of structures / heat sink in the three-dimensional modules
- Year
- 2013 Issue 1 Pages 77 - 82
- Code EDN
- Code DOI
- Abstract
- The thermal burdening and strength of the functional three-dimensional multichip modules has been researched. The regularities to the thermal burdening of the chips power, the thermal conductivity of materials, the occurrence windows for heat transfer in polyimide circuit boards, the methods of installation the modules to the heatspreading base has been established. The recommendations of designing multichip modules with the effective heat sink have been developed.
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