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- Article name
- RESEARCH OF THERMOMECHANICAL PROCESSES DURING COOLING OF QFN MOLDED LEADFRAME AFTER HIGH-TEMPERATURE INJECTION MOLDING
- Authors
- Razzhivalov P. N., , razzhivalovpavel@gmail.com, National Research University of Electronic Technology; Scientific and Production Enterprise "Optical-Electronic Complexes and Systems", Moscow, Russia
Vertyanov D. V., , vdv.miet-soyuz@yandex.ru, National Research University of Electronic Technology MIET, Moscow, Zelenograd, Russia
Rabtsevich V. A., , fuze122112@gmail.com, National Research University of Electronic Technology MIET, Moscow, Zelenograd, Russia
Belyakov I. A., , igor-terra@yandex.ru, National Research University of Electronic Technology MIET, Moscow, Zelenograd, Russia
- Keywords
- press-material / EMC / packaging / injection molding / QFN / leadframe
- Year
- 2026 Issue 2 Pages 52 - 58
- Code EDN
- EALRPL
- Code DOI
- 10.52190/1729-6552_2026_2_52
- Abstract
- The article presents an analysis of the technological process of high-temperature injection molding for the manufacture of QFN packaging. The result of the study includes an analysis of the leadframe base material and leadframe surface finish material composition. The cooling process of the molded leadframe after trsnsfer molding was modeled in two versions: without clamping and in a compressed state when using clamping equipment with fluoroplastic gaskets. According to the simulation results, the cooling time for the snap-on version increased, but did not exceed the limits of one molding cycle of 120 seconds. The simulation showed that the thermomechanical stresses did not exceed the strength limits of the using materials.
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