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- Article name
- THERMOMECHANICAL STRENGTH OF MATERIALS MULTICHIP MICROMODULES
- Authors
- Pogalov A. I., , dtm@miee.ru, Moscow Institute of Electronic Technology (Technical University), Moscow, Russia
Blinov G. A., , mg@miee.ru, Moscow Institute of Electronic Technology (Technical University), Moscow, Russia
CHUGUNOV E. Yu., , , National Research University of Electronic Technology, Moscow, Russia
- Keywords
- multichip micromodules / models / thermal strength
- Year
- 2010 Issue 4 Pages 34 - 38
- Code EDN
- Code DOI
- Abstract
- The main principles and assumptions of multichip micromodules thermal strength modelling are presented. The finite-element models are developed, the results of mo-delling are presented, the effect of the design-manufacturing factors on the stress-stain state is researched. The most significant factors of micromodules thermal strength are established.
- Text
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