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- Article name
- Study of heat resistance of metal-composite connections in multilayer printed circuit boards avionics
- Authors
- MEDVEDEV A. M., , medvedevam@bk.ru, Moscow Aviation Institute (National Research University), Moscow, Russia
- Keywords
- printed circuit boards / glass-epoxide composite material / heat resistance of connections in transversal direction / metalized holes / ductility / strain measurements
- Year
- 2013 Issue 4 Pages 45 - 48
- Code EDN
- Code DOI
- Abstract
- Requirements for the thermal resistance of metalized through holes printed circuit boards made of glass-epoxide composite materials were defined. Using of transversal connection of the strain gauge allowed obtaining more accurate data on the thermal deformations of metal-composite connection. It was established that the ductility of metalized coating of printed circuit connections must not be less than 6 %.
- Text
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