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- Article name
- Wetting and drying mechanisms of printed circuit boards composite supports
- Authors
- RAZORENOV A. G., , 7111@7884444.ru, ZAO Enterprise "Ostec", Moscow, Russia
- Keywords
- supports of printed circuit boards / composite materials / moisture / wetting / drying / diffusion / reliability / electronic equipment
- Year
- 2015 Issue 1 Pages 15 - 25
- Code EDN
- Code DOI
- Abstract
- Wetting and drying processes of composite supports of printed circuit boards (PCB) widely used in electronics are considered. Supports PCB are made mostly from polymeric composites, in particular from glass epoxy reinforced epoxy plastics. Owing to composite structure heterogeneity mechanisms of humidifying and drying of supports of PCB we exposed for ensuring of reliability of electronic devices. It is noted that if at soldering of various electronic components to composite supports of PCB group heating uses, then are supports delaminated owing to intensive evaporation of moisture at high temperatures of soldering processes. Demands to maximum values of PCB wetting and drying regimes at preparation of PCB to assembling were developed
- Text
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