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- Article name
- Production of porous Si3N4-based materials using thermoplastic slurries
- Authors
- GILEV V. G., , xray@pm.pstu.ac.ru, Research center of powder materials science of Perm National Research Polytechnic University, Perm, Russia
- Keywords
- high-porosity silicon nitride / thermoplastic slip / Raman spectra / oxidation bonding
- Year
- 2018 Issue 4 Pages 11 - 16
- Code EDN
- Code DOI
- Abstract
- The technology of highly porous reaction bonded silicon nitride, based on the molding of prefabricated elements (turning chips) from a thermoplastic slip on the basis of silicon has been developed. The data on the effect of the thickness of chips on strength and thermal shock resistance are given. To assess the role of the addition of silicon nitride nanoparticles, the model compositions the thermoplastic binder-Si3N4 are studied. It is established that strong cooling structures of these compositions make it possible to obtain blanks with a porosity of up to 80 %. After oxidative binding Si3N4-SiO2 composites with a porosity of 50-60 % were obtained.
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