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- Article name
- Electroadhesion bond of dielectric and electroconductive materials
- Authors
- BOGOMOL'NYI V. M., , , Russian State University of Tourism and Service, Moscow, Russia
- Keywords
- electroadhesion / dielectric / metal / technology / microelectronics / modification
- Year
- 2011 Issue 4 Pages 38 - 43
- Code EDN
- Code DOI
- Abstract
- Electroadhesive bond (EAB) of the dielectrics with metals at simultaneous action of electrical and mechanical oscillatios was considered. Possibility of EAB technology modification was shown take into account theirs electroconductivity and geometrical surface roughness parameters. Formulas for calculation of the EAB technological parameters were gived.
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